Original MECHANIC Soldering Paste BGA Solder Tin Flux Sn63/Pb37 183C Melting Soldering Iron Cream Circuit Board Repair Tools
- Brand Name: ESPLB
- Origin: CN(Origin)
- Model Number: XG50/XGZ40/XGSP40/XGSP80/XGSP30/XGSP50
- Particle Size: 25-48μm
MECHANIC High Synthetic Soldering Tin Paste XG-Z40 / XG-50 for Phone Chip Reballing Sn63/Pb37 25-45um 10CC BGA PCB BGA Repair Tool
Product Features
- Advanced insulation technology, a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips.
- The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board.
- Super compacity: Soldering paste for cell phone PCB, SMD, PGA and computer etc.
- Help to repair the circuit boards and protect the electronic components
- Flux Solder Paste – no clean soldering
- Syringe solder paste is an ideal assistant for phone motherboard and repairing cell phone surface mount assemblies.
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The syringe plunger will provide premium activity levels with maximum wetting and spreading, 10cc syringe is available for all rework soldering and desoldering repairs.
- High quality, perfect performance, easy to weld.
- Suitable for mobile phone repair industry, computer digital service industry, high-precision circuit board SMD welding, BGA welding technology and so on.
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Color | XG-50 35G, XG-Z40 35G, XGSP30 20G, XGSP40 35G, XGSP50 42G, XGSP80 60G |
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