Original MECHANIC Soldering Paste BGA Solder Tin Flux Sn63/Pb37 183C Melting Soldering Iron Cream Circuit Board Repair Tools
- Brand Name: ESPLB
- Origin: CN(Origin)
- Model Number: XG50/XGZ40/XGSP40/XGSP80/XGSP30/XGSP50
- Particle Size: 25-48μm
MECHANIC High Synthetic Soldering Tin Paste XG-Z40 / XG-50 for Phone Chip Reballing Sn63/Pb37 25-45um 10CC BGA PCB BGA Repair Tool
- Advanced insulation technology, a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips.
- The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board.
- Super compacity: Soldering paste for cell phone PCB, SMD, PGA and computer etc.
- Help to repair the circuit boards and protect the electronic components
- Flux Solder Paste – no clean soldering
- Syringe solder paste is an ideal assistant for phone motherboard and repairing cell phone surface mount assemblies.
The syringe plunger will provide premium activity levels with maximum wetting and spreading, 10cc syringe is available for all rework soldering and desoldering repairs.
- High quality, perfect performance, easy to weld.
- Suitable for mobile phone repair industry, computer digital service industry, high-precision circuit board SMD welding, BGA welding technology and so on.
XG-50 35G, XG-Z40 35G, XGSP30 20G, XGSP40 35G, XGSP50 42G, XGSP80 60G