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      Original MECHANIC Soldering Paste BGA Solder Tin Flux Sn63/Pb37 183C Melting Soldering Iron Cream Circuit Board Repair Tools

       

      • Brand Name: ESPLB
      • Origin: CN(Origin)
      • Model Number: XG50/XGZ40/XGSP40/XGSP80/XGSP30/XGSP50
      • Particle Size: 25-48μm

      MECHANIC High Synthetic Soldering Tin Paste XG-Z40 / XG-50 for Phone Chip Reballing Sn63/Pb37 25-45um 10CC BGA PCB BGA Repair Tool 

      Product Features 

      • Advanced insulation technology,  a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips.
      • The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board.
      • Super compacity:  Soldering paste for cell phone PCB, SMD, PGA and computer etc.
      • Help to repair the circuit boards and protect the electronic components
      • Flux Solder Paste – no clean soldering
      • Syringe solder paste is an ideal assistant for phone motherboard and repairing cell phone surface mount assemblies.
      • The syringe plunger will provide premium activity levels with maximum wetting and spreading, 10cc syringe is available for all rework soldering and desoldering repairs.

      • High quality, perfect performance, easy to weld.
      • Suitable for mobile phone repair industry, computer digital service industry, high-precision circuit board SMD welding, BGA welding technology and so on.
      Color

      XG-50 35G, XG-Z40 35G, XGSP30 20G, XGSP40 35G, XGSP50 42G, XGSP80 60G

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      SKU: 4000800214895 Category: